The computing and telecommunications industries have ambitious plans for the future: Systems that will store information in the cloud, analyze enormous amounts of data, and think more like a brain than a standard computer. Such systems are already being developed, and scientists at IBM Research have now demonstrated what may be an important step toward commercializing this next generation of computing technology. They established a method to integrate silicon photonic chips with the processor in the same package, avoiding the need for transceiver assemblies.

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Silicon dot comparison

For more than 40 years, Sil’tronix ST develops and manufactures valuable products regarding your specific needs.

For many years, Sil’tronix ST provides a large

quantity of silicon pieces for photonic applications.

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Silicon parts, standard dicing

For standard thicknesses from 150 µm to 1 mm, silicon wafers can be cut in small pieces with high precision (± 0.02 mm).

During the dicing operation the wafer is typically mounted on blue tape, yielding to the minimisation of particles. The area that has been cut away and called “die streets” are typically about 75µm wide.

The minimum dicing size is 1,5 x 1.5 mm up to 100 x 100 mm for square wafers.

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Sil’tronix ST will be present on the next biannual Porous Semiconductors Science and Technology (PSST) Conference organized in La grade Motte (France) from the 11th to 16th March.

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Credit: University of Surrey

An international team of scientists, led by the University of Surrey, has discovered a new type of silicon that could be used to control light beams in a new kind of photonic chip – a chipset where information is carried by light beams rather than electrical currents.

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For more than 40 years, Sil’tronix ST manufactures customized silicon wafers regarding your own specifications.

From the raw material to growth the monocrystalline ingot up to the cleaning process, each step are handled within our factory in order to provide the reliability requested to ensure the achievement of your topics.

This video aims to show the whole capabilities provided to manufacture your specific Si wafers:

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Crystal characterized with X-ray topography from Sil’tronix ST and another supplier.

The topographers are recorded to a 20 keV photon energy and show a 40 mm long section of the 120 mm long crystals installed as a second crystal in a double crystal monochromator.

Both crystals show a very good crystallinity. The Si crystal from Sil’tronix ST is almost free of defects, while the one from the other supplier shows scratches on the surface, most probably due to the polishing process.

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Silicon wafer Orientations

Silicon crystals are characterized by an orderly array of their atoms. In monocrystalline crystals, this arrangement is the same wherever the zone within the crystal.

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In order to provide reliable and qualitative products, Sil’tronix ST manufactures its own products totally internally throughout its factory between Mont Blanc and Geneva for more than 40 years.

To produce silicon wafers or silicon crystals from the pulling process, we observe the production flow below.

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We are now able to provide hybrid wafers i.e., a wafer substrate with one or several crystal thin films of quartz, PZT, lithium niobate, etc.

Processes based on crystal growth and on ion implantation have been developed to produce thin films. However, these technologies present some technological limits: all materials cannot be processed, obtaining thin films presenting the same properties as bulk materials is difficult and the layer thickness is limited to a few microns.

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Over the past 20 years, scientists have been developing metamaterials, or materials that don't occur naturally and whose mechanical properties result from their designed structure rather than their chemical composition. They allow researchers to create materials with specific properties and shapes. Metamaterials are still not widely used in everyday objects, but that could soon change.

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A group of researchers led by Stanislav Evlashin, a senior research scientist at the Skoltech Center for Design, Manufacturing and Materials (CDMM), demonstrated a simple and 100% efficient method of converting silicon wafers into nanoparticles in an aqueous solution. This discovery can help find an environmentally friendly way of silicon recycling without using toxic chemicals.

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