Innovation : very thin Wafer

Dear Customer,

Sil’Tronix ST is proud to announce a new specification to our portfolio : thin silicon wafer !

Thanks to new improvements in our silicon wafer manufacturing process, we are able to produce thin silicon wafer
We achieved to take the thickness down to 90µm for 4’’ wafer and to 300µm for 6’’ wafer. 
By doing this, we are able to keep the best wafer quality, i.e. TTV under 10 and roughness by 1nm.  

Furthermore, Sil’Tronix ST is able to provide any thickness (from 90µm to 3cm) for any diameter (up to 6’’). If you need a non-standard thickness, please send us a request for quotation ! This is also, of course, possible for small quantities.  

An overview of the lowest thickness that we now provide :

Growing Method

Type/Doping

Diameter
(mm)

Orientation

Thickness
(µm)

TTV
(µm)

Roughness
(nm)

FZ or CZ

Any, also undoped

100

Any

90 ±10

≤10

≤1

FZ or CZ

Any, also undoped

150

Any

300 ±10

≤10

≤1

typical thinning scratches on silicon wafer Typical thinning grooves on silicon wafer

thin silicon wafer after miror finish polishing

Thin silicon wafer after mirror finish polishing

Measurements: 

150mm: batch of 5 silicon wafer double side polished, thickness 300µm ±10

 

Thickness
(µm)

TTV
(µm)

Bow
(µm)

A

309

4,9

37,0

B

309

4,7

7,0

C

307

5,2

22,0

D

307

4,6

18,0

E

309

3,6

9,0

Roughness: 

RMS = 3.6Å on 25µm x 25µm

1478_05-07-2015_25x25um.jpg     

RMS = 2.2Å on 5µm x 5µm 

1478_05-07-2015_5x5um.jpg

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