Sil'tronix product information (March)

Silicon parts, standard dicing

For standard thicknesses from 150 µm to 1 mm, silicon wafers can be cut in small pieces with high precision (± 0.02 mm).

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During the dicing operation the wafer is typically mounted on blue tape, yielding to the minimisation of particles. The area that has been cut away and called “die streets” are typically about 75µm wide.

The minimum dicing size is 1,5 x 1.5 mm up to 100 x 100 mm for square wafers.

Silicon parts, slicing

By using a dicing saw, it is possible to process wafers with a thickness lower than 1mm. For thicker wafer, we can also propose to cut the wafer into small pieces using ID saw. We provide the slicing process for pieces reaching 20 mm.

Hexagonal wafer.pngTo reach your individual purposes, we developed a range of solutions to dice the wafers in square, rectangular or even more, exotic shapes through the specific process which is the most relevant in order to provide the best quality.

As an example, we are able to dice Si wafers without any burning on edges in order to avoid damages on your devices which could be already burnt on the substrate. On request, we provide also a poka-yoke solution in order to provide you the closest product needed for your topics.

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Optional

For particular shapes, we provide also solutions through laser cutting in order to reach your own specification which could be absolutely unique regarding your topics.

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A group of researchers led by Stanislav Evlashin, a senior research scientist at the Skoltech Center for Design, Manufacturing and Materials (CDMM), demonstrated a simple and 100% efficient method of converting silicon wafers into nanoparticles in an aqueous solution. This discovery can help find an environmentally friendly way of silicon recycling without using toxic chemicals.

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