Sil’tronix ST product information

Silicon wafer Orientations

Silicon crystals are characterized by an orderly array of their atoms. In monocrystalline crystals, this arrangement is the same wherever the zone within the crystal.

Silicon belongs to the cubic crystal system with a diamond structure. This is characterized by having each atom symmetrically surrounded by four equally spaced neighbours in a tetrahedral arrangement.

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Although Sil’tronix Silicon Technologies provides silicon ingot with the main (100) and (111) orientations, we supply silicon wafers with specific orientations (e.g. (311) or (510)).

Sil’tronix Silicon Technologies uses an X-ray diffraction system to identify the planes within the silicon crystal structure in order to insure a precise orientation for machining toward a standard accuracy of 0.5 degrees. We are able to improve this accuracy to 0.01° if needed. To get this very tight accuracy, Sil’tronix ST uses a special designed bond jig. Then, the orientated material is forwarded to the diamond machining stage.

Sil’tronix Silicon Technologies provides wafers with off orientation relative to the initial axis axis (100) or (111). This off orientation can vary from 0.2° (accuracy 0.01°) up to 40° (accuracy 0.5°).


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