Edge rounding on silicon wafers

Edge rounding

Silicon is very hard, yet brittle material. The sharp edge of sawn wafers fractures readily, producing unacceptable edge chips and particles.

In order to minimize the risk of breakage, the SEMI standard forecasts an edge really specific.

This edge is ground with a diamond disk to remove the damages and eliminate peripheral stress. By edge grinding, the final diameter of the wafer is adjusted (Accuracy up to 0.02 mm). During this process, we adjust also the flat (major and minor) according the SEMI standard.

Edge grinding on silicon wafers

Specific profile

On customer’s request, we provide non-standard wafer.

We can adjust the diameter of the wafer to a specific value (e.g; 60mm diameter). We can also modify the length or the position of the flat (e.g. JEIDA flat, for a 6 inches wafer, the length of the flat is 45.7mm). For silicon parts with a thickness above 1mm, we can also make a beveled edge (e.g., edge with 45° angle).

Learn more about our manufacturing process: Si wafer preparation

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