Sil'tronix at the European Materials Research Society

Join Sil'tronix Silicon Technologies from the 2nd to the 6th of may 2016 at the European Materials Research Society , Lille (France)


Silicon dot comparison

For more than 40 years, Sil’tronix ST develops and manufactures valuable products regarding your specific needs.

For many years, Sil’tronix ST provides a large

quantity of silicon pieces for photonic applications.

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Silicon parts, standard dicing

For standard thicknesses from 150 µm to 1 mm, silicon wafers can be cut in small pieces with high precision (± 0.02 mm).

During the dicing operation the wafer is typically mounted on blue tape, yielding to the minimisation of particles. The area that has been cut away and called “die streets” are typically about 75µm wide.

The minimum dicing size is 1,5 x 1.5 mm up to 100 x 100 mm for square wafers.

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