The Czochralski (Cz) Pulling process to achieve Silicon wafers and Silicon crystals
The semiconductor industry is manufacturing chips that are included in all electronic devices, telephones, computer, television, watch industries, optics, photonics, micro sensors, MEMS, etc…
To manufacture those devices in mass production, the starting raw material has been silicon since more than 45 years. Today, new materials are arriving in this industry, but silicon is still in first position.
Join Sil'tronix Silicon Technologies from the 14th to the 16th of december 2016 at the Semicon Japan (Tokyo, Japan)
Sil'tronix will be present Booth 414 at SEMICON EUROPA at Grenoble in October 2016
In April's Newsletter, we emphasized the work of Dr. Ilio Miccoli from the
University of Hannover. This month, we would like to encourage the work of the young start-up SiLiMiXT.
You probably know Sil'tronix as a Silicon Wafer manufacturer. However, we are also recognized as a specialist of Si and Ge crystals/parts for X-Ray and Infrared applications.
Join Sil'tronix Silicon Technologies from the 2nd to the 6th of may 2016 at the European Materials Research Society , Lille (France)
Ideal one-dimensional (1D) electronic systems have peculiar properties, such as quantization of conductance, charge-density waves (CDWs), and Luttinger-liquid behavior, a variety of instabilities with a wealth of associated phase transitions. These are due to their reduced dimensionality and the concomitant high electronic correlations. However, systems that are experimentally realized are inevitably coupled in two (2D) or three (3D) dimensions.
Sil'Tronix ST is now offering in-house dry thermal oxidation SiO2 grown layers from 1 to 4'' wafer diameters and up to 400 nm thick (please contact us for larger thicknesses). Dry thermal oxidation enables high quality layers in terms of thickness uniformity (5 %<), surface roughness (<0.3 nm) and breakdown voltage (>200V for 285 nm thick layer, for instance) to be grown.